Magnetoresistive element

ABSTRACT

According to one embodiment, a magnetoresistive element includes a recording layer having magnetic anisotropy perpendicular to a film surface and having a variable magnetization direction, a reference layer having magnetic anisotropy perpendicular to a film surface and having an invariable magnetization direction, an intermediate layer provided between the recording layer and the reference layer, and a underlayer containing AlTiN and provided on an opposite side of a surface of the recording layer on which the intermediate layer is provided.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.14/160,419, which was filed on Jan. 21, 2014 and is titled“MAGNETORESISTIVE ELEMENT,” and which is a continuation of InternationalApplication No. PCT/JP2012/063574, filed May 21, 2012, which is basedupon and claims the benefit of priority from Japanese Patent ApplicationNo. 2011-160806, filed Jul. 22, 2011, and Japanese Patent ApplicationNo. 2012-105812, filed May 7, 2012, the entire contents of all of whichare incorporated herein by reference.

FIELD

Embodiments described herein relate generally to a magnetoresistiveelement.

BACKGROUND

A spin transfer torque MRAM (Magnetic Random Access Memory) using aperpendicular magnetization film for a recording layer is advantageousin order to decrease a write current and increase the capacity. Astacked film consisting of cobalt (Co) and platinum (Pt) each having adense atomic plane has high crystal magnetic anisotropy of 10⁷ erg/cm²,and can achieve a high magnetoresistive ratio (MR ratio) with lowresistivity. Such stacked film is, therefore, receiving attention as atechnique for achieving large scale integrated MRAM.

On the other hand, in terms of crystal structure, ruthenium (Ru) is usedas an underlayer made of a CoPt alloy. The Ru underlayer increases thedamping constant of a recording layer. This undesirably increases awrite current. In a spin transfer torque MRAM using a perpendicularmagnetization film, a write current increases in proportion with thedamping constant, in inverse proportion with the spin polarizability,and in proportion with the area. A technique of decreasing the dampingconstant, increasing the spin polarizability, and reducing the area isnecessary for decreasing the write current.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view showing an MTJ element according to the firstembodiment;

FIG. 2 is a graph showing the magnitude of a damping constant α as afunction of a thermal stability Δ when an underlayer made of each ofvarious materials is used according to the first embodiment;

FIG. 3 is a graph showing an MR ratio (magnetoresistive ratio) as afunction of a Ti content (X) of Al_((100-X))Ti_(X)N of an underlayeraccording to the first embodiment;

FIG. 4 shows graphs representing the magnetic characteristics (M-Hcurves) of the MTJ element when the concentrations of Al and Ti of theunderlayer are changed according to the first embodiment;

FIG. 5 is a graph showing RA (resistance) as a function of a Ti content(X) of Al_((100-X))Ti_(X)N of an underlayer according to the firstembodiment;

FIG. 6 is a graph showing RAs (resistances) as a function of the filmthickness of the underlayer when the Ti concentration is 0% (Al₅₀N₅₀)and when the Ti concentration is 20% ((Al₈₀Ti₂₀)₅₀N₅₀) according to thefirst embodiment;

FIGS. 7A and 7B are sectional views showing modifications of the MTJelement according to the first embodiment;

FIG. 8 is a sectional view showing an MTJ element according to thesecond embodiment;

FIG. 9 shows graphs representing magnetic characteristics (M-H curves)of the MTJ element when a lower electrode made of Ta is used and theconcentrations of Al and Ti of an underlayer are changed according tothe second embodiment;

FIGS. 10A, 10B and 10C show graphs representing the saturationmagnetization Ms (emu/cc) of a recording layer, the coercive force Hc(Oe) of the recording layer, and the magnetic anisotropy field Hk (Oe)when the concentrations of Al and Ti of the underlayer are changedaccording to the second embodiment;

FIGS. 11A and 11B are sectional views showing modifications of the MTJelement according to the second embodiment;

FIG. 12 is a sectional view showing an MTJ element according to thethird embodiment;

FIG. 13 is a graph showing a result of evaluating the perpendiculareffective magnetic anisotropy energy Ku-eff (erg/cc) of a recordinglayer using an underlayer made of a B, C, N, O, or metal compound of Ta,Hf, or W according to the third embodiment;

FIG. 13A is a graph showing damping constants in various kinds ofunderlayers according to the third embodiment;

FIG. 13B is a graph showing a result of comparing magnetization reversalcurrents when a Ta underlayer is used and when an AlTiN underlayer isused according to the third embodiment;

FIGS. 14A and 14B are sectional view showing modifications of the MTJelement according to the third embodiment;

FIG. 15 is a sectional view showing an MTJ element according to thefourth embodiment;

FIG. 16 is a view showing the magnetic characteristics (M-H curves) ofthe MTJ element when, in a recording layer including three layers, FeBor CoB is used as a magnetic layer and Nb or Ta is used as a nonmagneticlayer according to the fourth embodiment;

FIGS. 17A and 17B are sectional views showing modifications of the MTJelement according to the fourth embodiment;

FIG. 18 is a sectional view showing an MTJ element according to thefifth embodiment;

FIG. 19 is a sectional view showing a modification of the MTJ elementaccording to the fifth embodiment;

FIGS. 20A and 20B are sectional views showing modifications of the MTJelement according to the fifth embodiment; and

FIGS. 21A and 21B are sectional views showing modifications of the MTJelement according to the fifth embodiment.

DETAILED DESCRIPTION

In general, according to one embodiment, a magnetoresistive elementcomprises a recording layer having magnetic anisotropy perpendicular toa film surface and having a variable magnetization direction, areference layer having magnetic anisotropy perpendicular to a filmsurface and having an invariable magnetization direction, anintermediate layer provided between the recording layer and thereference layer, and an underlayer containing AlTiN and provided on theopposite side of the surface of the recording layer on which theintermediate layer is provided.

Embodiments will be described below with reference to the accompanyingdrawings. Note that the drawings are diagrammatic and schematic anddimensions and ratios in each drawing are not necessarily to scale. Whenthe same portions are shown in the drawings, their dimensions and ratiosmay be represented differently. In some embodiments to be describedbelow, a magnetoresistive element for implementing the technicalprinciples of the present embodiment is exemplified, and the shapes,structures, arrangements, and the like of components do not limit thetechnical principles of the present embodiment. Note that the samereference numerals denote elements having the same functions andarrangements in the following description, and a repetitive descriptionwill be made only when necessary.

[1] First Embodiment [1-1] Arrangement of MTJ Element 10

The arrangement of the MTJ element 10 as a magnetoresistive elementaccording to the first embodiment will be described with reference toFIG. 1.

The MTJ element 10 includes a lower electrode 11, an underlayer 12, arecording layer 13, an intermediate layer 14, a reference layer 15, andan upper electrode 16 which are sequentially stacked from the bottom.

Each of the recording layer 13 and reference layer 15 is made of aferromagnetic material, and has magnetic anisotropy perpendicular to afilm surface. The directions of easy magnetization of the recordinglayer 13 and reference layer 15 are perpendicular to the film surfaces.That is, the MTJ element 10 is a perpendicular magnetization type MTJelement in which the magnetization directions of the recording layer 13and reference layer 15 are perpendicular to the film surfaces. Note thatthe direction of easy magnetization is the direction of spontaneousmagnetization in which the internal energy of an assumed ferromagneticmaterial having a certain macro size is minimized without an externalmagnetic field. The direction of hard magnetization is the direction ofspontaneous magnetization in which the internal energy of an assumedferromagnetic material having a certain macro size is maximized withoutan external magnetic field.

The magnetization (or spin) direction of the recording layer 13 isvariable (reversible). The magnetization direction of the referencelayer 15 is invariable (fixing). The reference layer 15 is set to haveperpendicular anisotropy energy sufficiently larger than that of therecording layer 13. The anisotropy energy is settable by adjusting thematerial composition and film thickness. In this way, the magnetizationreversal current of the recording layer 13 is decreased, and themagnetization reversal current of the reference layer 15 is increased tobe larger than that of the recording layer 13. This can realize, for apredetermined write current, an MTJ element 10 which includes arecording layer 13 having a variable magnetization direction and areference layer 15 having an invariable magnetization direction.

The intermediate layer 14 is made of a nonmagnetic material, and anonmagnetic metal, a nonmagnetic semiconductor, an insulator, or thelike can be used. When an insulator is used as the intermediate layer14, it is called a tunnel barrier layer. When a metal is used as theintermediate layer 14, it is called a spacer layer.

The underlayer 12 has a function of improving the magnetic anisotropy ofthe recording layer 13. The damping constant of the recording layer 13may increase depending on a material in contact with the recording layer13. This is known as a spin pumping effect. The underlayer 12 has afunction of decreasing the damping constant of the recording layer 13 byreducing the spin pumping effect.

The underlayer 12 is made of a nitrogen compound such as AlTiN. Theunderlayer 12 made of AlTiN is deposited by, for example, sputteringaluminum (Al) and titanium (Ti) using a mixed gas containing nitrogen(N₂) and argon (Ar). Alternatively, an alloy of aluminum and titaniummay be sputtered using a mixed gas containing nitrogen (N₂) and argon(Ar). It is also possible to deposit the underlayer 12 by sputtering analuminum titanium nitride using an argon (Ar) gas. The arrangement ofthe underlayer 12 will be described in detail below.

An example of the arrangement of the MTJ element 10 will be describedbelow. In the following explanation, a numerical value inside theparentheses appended to an element indicates a film thickness, the unitof which is Å. A symbol “/” represents that an element to the left of“/” is stacked on an element to the right of “/”.

The lower electrode 11 is made of Ta (200)/Cu (400)/Ti (100). Theunderlayer 12 is made of AlTiN (10). The recording layer 13 is made ofFeB (14). The intermediate layer (tunnel barrier layer) 14 is made ofMgO (10). The reference layer 15 is made of TbCoFe (120)/CoFeB (4)/Ta(3)/CoFeB (15). The upper electrode 16 is made of Ru (200)/Ta (50).

Note that the recording layer 13 may be made of CoFe or CoFeB instead ofFeB. In this case, the concentration of Fe is desirably made higher thanthat of Co. Furthermore, the recording layer 13 may be made of Fe. Evenif such recording layer 13 is made of CoFe or CoFeB in which theconcentration of Fe is higher than that of Co, or FeB or Fe, it maycontain other elements in the material, and need only contain thematerial as a major component. Using such material can improve theperpendicular magnetic anisotropy of the recording layer 13.

[1-2] Underlayer 12 Made of Nitrogen Compound

Conventionally, a technique of obtaining a damping constant α smallerthan 0.01 while having high perpendicular magnetic anisotropy has beenconsidered as one of the biggest issues in using a perpendicularmagnetization film for the recording layer 13, and has been developedall over the world. However, it has been considered to be difficult toimplement this technique. A write current is in proportion with thedamping constant α. If, therefore, it is possible to decrease thedamping constant α, it is also possible to decrease the write current.

The present applicant, however, has found an arrangement capable ofsolving the above problem. That is, it has been found that using anitrogen compound such as AlTiN or AlN for the underlayer 12 of therecording layer 13, it is possible to decrease the damping constant αwhile keeping enough thermal stability Δ. This will be described indetail below.

FIG. 2 shows the magnitude of the damping constant α as a function ofthe thermal stability Δ when an underlayer 12 made of each of variousmaterials is used. Note that a recording layer 13 with a size φ of 40 nmis used and AlTiN, AlN, W, Nb, Mo, Hf, or Zr is used as the material ofthe underlayer 12.

As is apparent from FIG. 2, when AlTiN or AlN is used as the material ofthe underlayer 12, it is possible to decrease its damping constant α to0.008 or smaller. That is, when the material of the underlayer 12 ischanged from a metal to a nitride (AlTiN or AlN), it is possible todecrease the magnitude of the damping constant α and to keep the thermalstability Δ high.

Since a nitride has high resistance to heat diffusion, it is possible tosuppress the diffusion of the underlayer 12 and the recording layer 13,and a distribution in the magnetic characteristics of the MTJ element10.

In terms of the above points, it is understood that it is effective touse a nitride as the material of the underlayer 12. Note that inaddition to AlTiN and AlN, examples of an effective nitride for theunderlayer 12 are ZrN, NbN, HfN, TaN, WN, and SiN. Since, however, AlTiNhas a small number of 3d electrons, an insulating property, and a smallnumber of free electrons, spin-orbit interaction with the recordinglayer 13 is weak and spin information transferred to the recording layer13 is less likely to be lost in the underlayer 12. For the abovereasons, AlTiN (AlN) among various nitrides is used as the underlayer12.

[1-3] Ti Concentration with Respect to Al of Underlayer 12

In this embodiment, AlTiN (AlN) is used as the underlayer 12. Variouscharacteristic changes of the MTJ element 10 along with a change in Ticoncentration with respect to Al (the composition of AlTi) will bedescribed. Note that a representation [Al_((100-X))Ti_(X)]N may be usedin this specification. For example, Al₈₀Ti₂₀N indicates that the ratiobetween the element counts of Al and Ti is 80:20 and the ratio betweenthe element counts of AlTi and nitrogen is 1:1.

FIG. 3 shows an MR ratio (magnetoresistive ratio) as a function of theTi content (X) of Al_((100-X))Ti_(X)N of the underlayer 12. The abscissain FIG. 3 represents a Ti concentration (X) (vol. %) with respect to Al.The ordinate in FIG. 3 represents the MR ratio (%) of the MTJ element10. Note that an underlayer 12 containing 50 at. % of nitrogen withrespect to the total content of Al and Ti is used. “vol. %” represents avolume percentage concentration and “at. %” represents an atomicpercentage.

As shown in FIG. 3, when the Ti concentration with respect to Alincreases from 0% to 30%, the MR ratio increases. When the Ticoncentration with respect to Al increases from 30% to 100%, the MRratio decreases. It is found that the MR ratio of Ti-added AlN increasesas compared with AlN (the Ti concentration is 0%).

In terms of the performance of the MRAM device, the MR ratio isdesirably at least 45% or higher. From this point of view, the Ticoncentration with respect to Al desirably falls within the range from10% (inclusive) to 50% (inclusive). That is, if the underlayer 12 ismade of Al_((100-X))Ti_(X)N, it is desirable to satisfy 10≦X≦50. Thereason why the Ti concentration with respect to Al influences the MRratio is as follows. If the Ti concentration with respect to Al is lowerthan 10% in AlN, the resistance of AlN increases and AlN is added to theintermediate layer 14 as a series resistance, thereby decreasing the MRratio. On the other hand, if the Ti concentration is higher than 50%,the magnetic characteristics of the recording layer 13 degrade, therebydecreasing the MR ratio. Furthermore, if the Ti concentration fallswithin the range from 10% (inclusive) to 50% (inclusive), AlTiN has anamorphous structure. Therefore, the underlayer 12 is flat and therecording layer 13 and the intermediate layer 14 formed on theunderlayer 12 are also flat, thereby increasing the MR ratio.

The ratio between AlTi and N in the underlayer 12 made of AlTiN isdesirably 1:1. If the AlTi content with respect to N increases, AlTi andthe recording layer 13 tend to diffuse, thereby degrading theperpendicular magnetic anisotropy of the recording layer 13. Electronsare set in a closed shell state when the content ratio of nitrogen andAlTi is 1:1, thereby achieving heat stabilization. The ratio betweenAlTi and N is, therefore, desirably 1:1.

Note that the underlayer 12 may contain elements other than Al, Ti, andN, and need only contain AlTiN as a major component.

[1-4] Consideration of Decrease in MR Ratio

As described above, when the Ti concentration of the underlayer 12 isequal to or higher than 50% or lower than 30%, the MR ratio decreases. Aresult of considering a cause of the decrease will be described.

A cause of a decrease in MR ratio when the Ti concentration of theunderlayer 12 is equal to or higher than 50% will be explained firstwith reference to FIG. 4.

FIG. 4 shows the magnetic characteristics (M-H curves) of the MTJelement 10 when the concentrations of Al and Ti of the underlayer 12 arechanged. The abscissa in FIG. 4 represents a magnetic field (Oe) in adirection perpendicular to the film surface. The ordinate in FIG. 4represents magnetization (emu) in a direction perpendicular to the filmsurface of the recording layer 13. Note that “E” in FIG. 4 indicates abase 10 exponential function.

Assume that the Ti concentration becomes 50% or higher. In this case, asshown in FIG. 4, when the abscissa (the magnetic field) is zero, theremanent magnetization ratio of the magnetization of the recording layer13 is smaller than 1. That is, when the Ti concentration becomes 50% orhigher, the perpendicular magnetic anisotropy of the recording layer 13degrades, the remanent magnetization ratio of the recording layer 13becomes smaller than 1, and it becomes impossible to set themagnetization directions of the recording layer 13 and the referencelayer 15 to be parallel or antiparallel to each other, therebydecreasing the MR ratio.

A cause of a decrease in MR ratio when the Ti concentration of theunderlayer 12 is lower than 30% will be described with reference to FIG.5.

FIG. 5 shows RA (resistance) as a function of the Ti content (X) ofAl_((100-X))Ti_(X)N of the underlayer 12. The abscissa in FIG. 5represents the concentration (X) (vol. %) of Ti with respect to Al. Theordinate in FIG. 5 represents the resistance RA (Ωμm²) of the MTJelement 10. Note that an the underlayer 12 containing 50 at. % ofnitrogen with respect to the total content of Al and Ti is used.

As shown in FIG. 5, when the Ti concentration with respect to Al becomeslower than 30%, the resistance RA of the underlayer 12 increases, andthe series resistance increases with respect to the resistance RA of theintermediate layer 14 of the MTJ element 10, thereby decreasing the MRratio.

[1-5] Effectiveness of Ti-Added AlN

In this embodiment, it is desirable to use, for the underlayer 12, AlTiNobtained by adding Ti to AlN. The reason for this is as follows.

As is apparent from FIG. 3, when the Ti concentration is 0%, that is,when the underlayer 12 is made of AlN, the MR ratio is very low ascompared with a case in which Ti is added. To increase the MR ratio, itis better to use, as the underlayer 12, AlTiN obtained by adding Ti toAlN as compared with AlN.

FIG. 6 shows RAs (resistances) as a function of the film thickness ofthe underlayer 12 when the Ti concentration is 0% (Al₅₀N₅₀) and when theTi concentration is 20% ((Al₈₀Ti₂₀)₅₀N₅₀). The abscissa in FIG. 6represents the film thickness (Å) of the underlayer 12. The ordinate inFIG. 6 represents the resistance RA (Ωμm²) of the underlayer 12.

It is apparent from FIG. 6 that it is possible to decrease theresistance RA of the underlayer 12 by about one order of magnitude whenthe Ti concentration is 20% ((Al₈₀Ti₂₀)₅₀N₅₀) as compared with a case inwhich the Ti concentration is 0% (Al₅₀N₅₀). When (Al₅₀N₅₀) is used, RAof MgO constituting the intermediate layer 14 is 10 Ωμm², and RA of(Al₅₀N₅₀) having a thickness of 1 nm as the underlayer 12 is 10 Ωμm² orlarger. Since, therefore, the resistance of the underlayer 12 is addedin series with the intermediate layer 14, the MR ratio becomes half orlower. On the other hand, when 20% of Ti are added to Al((Al₈₀Ti₂₀)₅₀N₅₀), RA of ((Al₈₀Ti₂₀)₅₀N₅₀) having a thickness of 1 nm is1 Ωμm², and the resistance of the underlayer 12 to the intermediatelayer 14 decreases, thereby enabling to suppress a decrease in MR ratio.The reason why MR is about several % when (Al₅₀N₅₀) is used as theunderlayer 12 is that the resistance of the underlayer 12 was added inseries with the intermediate layer 14 and that an increase in roughnessdue to isolation of the underlayer 12 exerted an influence.

[1-6] Effects

In the above-described first embodiment, a nitrogen compound (AlTiN)which can decrease the spin pumping effect is used for the underlayer12. This can decrease the damping constant (friction constant) of therecording layer 13, thereby enabling to decrease a write current for theMTJ element 10.

In the first embodiment, a nitrogen compound (AlTiN) which has highresistance to heat diffusion is used as the underlayer 12. This cansuppress the diffusion of the underlayer 12 and recording layer 13 and adistribution in the magnetic characteristics of the MTJ element 10.

In the underlayer 12 made of AlTiN, by setting the Ti concentration withrespect to Al to fall within the range from 10% (inclusive) to 50%(inclusive), it is possible to realize an MTJ element 10 for which aneffective MR ratio is ensured in terms of the device characteristics.

[1-7] Modifications

The first embodiment can be modified to have the arrangement of the MTJelement 10 shown in FIGS. 7A and 7B.

As shown in FIG. 7A, a thin underlayer 17 may be provided between therecording layer 13 and underlayer 12. An example of the underlayer 17 isiridium (Ir) having a film thickness of 1 nm or smaller. Since a thickIr layer increases the damping constant of the recording layer 13, thefilm thickness of the Ir layer is desirably 1 nm or smaller. In additionto iridium (Ir), palladium (Pd), platinum (Pt), and the like can be usedas the material of the underlayer 17. Note that it is necessary to makethe underlayer 17 thin so as not to increase the damping constant of therecording layer 13. According to the arrangement shown in FIG. 7A, it ispossible to further improve the perpendicular magnetic anisotropy of therecording layer 13.

As shown in FIG. 7B, an AlTiN layer may be used as a capping layer 22 ofthe recording layer 13 instead of the underlayer of the recording layer13. That is, the MTJ element 10 includes the lower electrode 11, thereference layer 15, the intermediate layer 14, the recording layer 13,the capping layer 22, and the upper electrode 16 which are sequentiallystacked from the bottom. The capping layer 22 is made of the samematerial as that of the above-described underlayer 12. According to aso-called bottom pin structure shown in FIG. 7B, it is possible toobtain the effects of decreasing a write current, improving theperpendicular magnetic anisotropy of the MTJ element 10, and decreasinga variation in the write current, similarly to a so-called top pinstructure shown in FIG. 1.

In the modification shown in FIG. 7B, a magnetic layer made of the samematerial as that of the underlayer 17 may be inserted between therecording layer 13 and the capping layer 22, similarly to thearrangement shown in FIG. 7A. This can further improve the perpendicularmagnetic anisotropy of the recording layer 13.

[2] Second Embodiment

In the second embodiment, it is possible to use TiN for an underlayer 12by controlling the material of a film in contact with the underlayer 12.

[2-1] Arrangement of MTJ Element 10

The arrangement of the MTJ element 10 according to the second embodimentwill be described with reference to FIG. 8.

The second embodiment is different from the first embodiment in that TiNis used as the underlayer 12, and an oxidizable material is used as alower electrode 11, which means that when the lower electrode 11 isexposed to the atmosphere, its surface or the whole forms an oxide atroom temperature. Using an oxidizable material for the lower electrode11 on which the underlayer 12 is deposited improves the wettability ofthe underlayer 12 and lower electrode 11, and the flatness of the lowerelectrode 11, thereby forming a uniform underlayer 12.

The oxidizable material of the lower electrode 11 desirably contains oneelement selected from the group consisting of, for example, Al, Si, Ti,V, Cr, Zr, Nb, Hf, Ta, W, Ge, Ga, B, and Mg.

When the underlayer 12 made of TiN is used, a layer made of anoxidizable material is not limited to the lower electrode 11. That is, alayer made of an oxidizable material need only be in direct contact withthe opposite side of the surface of the underlayer 12 on which arecording layer 13 is provided. For example, a layer made of anoxidizable material may be provided between the underlayer 12 and thelower electrode 11.

[2-2] Underlayer 12 Made of TiN

FIG. 9 shows the magnetic characteristics (M-H curves) of the MTJelement 10 when the concentrations of Al and Ti of the underlayer 12 arechanged using a lower electrode 11 made of Ta. Note that the range from−200 to 200 on the abscissa in FIG. 9 indicates a magnetic field (Oe)applied in a direction perpendicular to a film surface, and the rangefrom −5000 to 5000 or from −7000 to 7000 indicates a magnetic field (Oe)applied in an in-plane direction. The ordinate in FIG. 9 represents themagnetizations (emu) of the recording layer 13 in the directionperpendicular to the film surface and the in-plane direction. A solidline indicates the magnetic characteristics when the magnetic field isapplied in the direction perpendicular to the film surface, and a dottedline indicates the magnetic characteristics when the magnetic field isapplied in the in-plane direction.

As shown in FIG. 9, when the underlayer 12 is made of TiN, themagnetization in a direction perpendicular to the film surface does notdecrease at 0 of the abscissa (magnetic field) of the magneticcharacteristics. The remanent magnetization ratio as the ratio betweenthe saturation magnetization and the remanent magnetization is nearly 1.That is, even if the underlayer 12 is made of TiN, using the lowerelectrode 11 made of Ta enables to maintain the perpendicular magneticcharacteristics, thereby allowing to suppress a decrease in MR ratio forAlN added with 50% or more of Ti.

FIGS. 10A, 10B and 10C show the saturation magnetization Ms (emu/cc) ofthe recording layer 13, the coercive force Hc (Oe) of the recordinglayer 13, and the magnetic anisotropy field Hk (Oe) when theconcentration of Ti of the underlayer 12 with respect to Al is changed.

As shown in FIGS. 10A, 10B and 10C, if the concentration of Ti is madehigh, the saturation magnetization Ms is nearly invariable, the coerciveforce Hc of the recording layer 13 decreases, and the magneticanisotropy field Hk increases. This is probably because exchangecoupling between spins or between particles is weak.

[2-3] Effects

In the above-described second embodiment, a nitrogen compound (TiN)which can decrease the spin pumping effect is used for the underlayer12. This can decrease the damping constant (friction constant) of therecording layer 13, thereby enabling to decrease a write current for theMTJ element 10.

In the second embodiment, a nitrogen compound (TiN) which has highresistance to heat diffusion is used as the underlayer 12. This cansuppress the diffusion of the underlayer 12 and recording layer 13, anda variation in the magnetic characteristics of the MTJ element 10.

An oxidizable material such as Ta is used as the lower electrode 11 incontact with the underlayer 12. This can reduce the roughness of theunderlayer 12 and recording layer 13, and suppress degradation inperpendicular magnetic anisotropy, thereby ensuring an effective MRratio.

[2-4] Modifications

The second embodiment can be modified to have the arrangement of the MTJelement 10 shown in FIGS. 11A and 11B.

As shown in FIG. 11A, a thin underlayer 17 may be provided between therecording layer 13 and the underlayer 12. An example of the underlayer17 is iridium (Ir) having a film thickness of 1 nm or smaller. Since athick Ir layer increases the damping constant of the recording layer 13,the film thickness of the Ir layer is desirably 1 nm or smaller. Inaddition to iridium (Ir), palladium (Pd), platinum (Pt), and the likecan be used as the material of the underlayer 17. Note that it isnecessary to make the underlayer 17 thin so as not to increase thedamping constant of the recording layer 13. According to the arrangementshown in FIG. 11A, it is possible to further improve the perpendicularmagnetic anisotropy of the recording layer 13.

As shown in FIG. 11B, a TiN layer may be used as a capping layer 22 ofthe recording layer 13 instead of the underlayer of the recording layer13. That is, the MTJ element 10 includes the lower electrode 11, areference layer 15, an intermediate layer 14, the recording layer 13,the capping layer 22, and an upper electrode 16 which are sequentiallystacked from the bottom. The capping layer 22 is made of the samematerial as that of the above-described underlayer 12. The upperelectrode 16 in direct contact with the capping layer 22 is made of theabove-described oxidizable material. According to a so-called bottom pinstructure shown in FIG. 11B, it is possible to obtain the effects ofdecreasing a write current, improving the perpendicular magneticanisotropy of the MTJ element 10, and decreasing a variation in thewrite current, similarly to a so-called top pin structure shown in FIG.8.

In the modification shown in FIG. 11B, a magnetic layer made of the samematerial as that of the underlayer 17 may be inserted between therecording layer 13 and the capping layer 22, similarly to thearrangement shown in FIG. 11A. This can further improve theperpendicular magnetic anisotropy of the recording layer 13.

It is also possible to apply, to the first embodiment, the lowerelectrode 11 made of the material according to this embodiment.

[3] Third Embodiment

In the third embodiment, a boride is used as an underlayer 12.

[3-1] Arrangement of MTJ Element 10

The arrangement of the MTJ element 10 according to the third embodimentwill be described with reference to FIG. 12.

The third embodiment is different from the first embodiment in that aboride is used as the material of the underlayer 12. More specifically,the underlayer 12 is made of a boride containing one element selectedfrom the group consisting of Al, Si, Ti, V, Cr, Zr, Nb, Hf, Ta, W, Ge,and Ga.

[3-2] Underlayer 12 Made of Boride

A boride, as the material of the underlayer 12 of this embodiment,containing one element selected from the group consisting of Al, Si, Ti,V, Cr, Zr, Nb, Hf, Ta, W, Ge, and Ga is formed with a transition metalhaving a small number of d electrons such as Ti, V, Cr, Zr, Nb, Hf, Ta,or W, or a nontransition metal such as Al, Si, Ge, or Ga. It is,therefore, possible to decrease the damping constant, and to decreasethe number of free electrons by boriding the material, thereby reducingspin-orbit interaction occurring between a recording layer 13 and theunderlayer 12. This is effective to decrease the damping constant.

FIG. 13 is a graph showing a result of evaluating the perpendicularanisotropy energy Ku-eff (erg/cc) of the recording layer 13 using anunderlayer 12 made of a boride of Ta or Hf (TaB₂ or HfB₂) (denoted by“B” in FIG. 13), a carbide (TaC or HfC) (denoted by “C” in FIG. 13), anitride (TaN or HfN) (denoted by “N” in FIG. 13), an oxide (TaO or HfO)(denoted by “O” in FIG. 13), or a metal of Ta, Hf, or W (elemental metalof Ta, Hf, or W) (denoted by “metal” in FIG. 13). As is apparent fromFIG. 13, using an underlayer 12 made of a B compound (TaB or HfB)enables to obtain high perpendicular magnetic anisotropy of therecording layer 13.

FIG. 13A shows the damping constant of the recording layer 13 using eachunderlayer 12 when a compound of Hf and AlTi is formed using oxidation,boriding, nitriding, or both nitriding and boriding.

Comparing metal underlayers, a damping constant α of AlTi is smallerthan that of Hf. This is because a light element is used as anunderlayer material and the spin-orbit interaction between theunderlayer and the recording layer reduces by changing 5d electrons ofHf to 3d electrons of Ti. That is, a metal material containing a mixtureof nitrogen and boron is desirably a 3d transition metal or anontransition metal.

On the other hand, even when using a 5d transition metal, it is possibleto decrease the damping constant using a boride or nitride. Although thedamping constant α of an oxide or metal is high, it becomes 0.01 orsmaller upon using a boride, nitride, or boron nitride, therebysufficiently decreasing the damping constant. For a metal, the dampingconstant α takes a large value such as 0.01 or larger. This is becauseof diffusion of the underlayer and recording layer and the spin pumpingeffect of Hf. On the other hand, by nitriding or boriding, the spin ofHf disappears and the spin-orbit interaction between the recording layerand the underlayer reduces. This results in a decrease in the spinpumping effect, thereby enabling to decrease the damping constant.

Furthermore, since a boride has perpendicular magnetic anisotropy higherthan those shown in FIG. 13, it is possible to manufacture a recordinglayer having a small damping constant and high record retentionperformance.

Table 1 shows various characteristics when HfB is used as an underlayerand when AlTiN is used as an underlayer.

Using an HfB underlayer makes it possible to obtain a high MR ratio.This is because a B-based material is used for the recording layer, somixing the same class of element into the underlayer material decreasesthe interfacial energy between the underlayer and the recording layer,thereby enabling to manufacture a flat recording layer. As a result, itis possible to form a flat tunnel barrier layer, and to obtain a high MRratio.

TABLE 1 Underlayer HfB AlTiN Ta Recording layer CoFeB (14Å) FeB (14Å)CoFeB(14Å) damping constant 0.007 0.004 0.02 MR 182% 146% 145%

FIG. 13B is a graph showing a result of comparing magnetization reversalcurrents when a Ta underlayer is used and when an AlTiN underlayer isused.

Since the MRs of equivalent films are compared, the difference betweenthe magnetization reversal currents is presumably attributed to thedifference between damping constants to a large extent. It is found thatthe magnetization reversal current when the AlTiN underlayer is used ishalf or smaller as compared with a case in which the Ta underlayer isused. With the Ta underlayer, the damping constant between the recordinglayer and the underlayer increases due to an increase in dampingconstant of the recording layer because of diffusion and due to the spinpumping effect of the underlayer, thereby increasing a write current.With the AlTiN underlayer, since it is possible to suppress thediffusion and the spin pumping effect, the damping constant decreasesand a write current also decreases. That is, it is possible to obtainnearly equal MRs using a nitride underlayer as compared with a metalunderlayer, and it is also possible to decrease the magnetizationreversal current and the write current. A boride underlayer can decreasethe damping constant and obtain a high MR ratio as compared with a metalunderlayer such as Ta.

As described above, the underlayer 12 made of a boride can improve theperpendicular magnetic anisotropy of the recording layer 13 whiledecreasing its damping constant.

[3-3] Effects

In the above-described third embodiment, a boride is used as theunderlayer 12. This decreases the damping constant, thereby enabling todecrease a write current. It is also possible to improve theperpendicular magnetic anisotropy of the recording layer 13.

[3-4] Modifications

The third embodiment can be modified to have the arrangement of the MTJelement 10 shown in of FIGS. 14A and 14B.

As shown in FIG. 14A, a thin underlayer 17 may be provided between therecording layer 13 and the underlayer 12. An example of the underlayer17 is iridium (Ir) having a film thickness of 1 nm or smaller. Since athick Ir layer increases the damping constant of the recording layer 13,the film thickness of the Ir layer is desirably 1 nm or smaller. Inaddition to iridium (Ir), palladium (Pd), platinum (Pt), and the likecan be used as the material of the underlayer 17. Note that it isnecessary to make the underlayer 17 thin so as not to increase thedamping constant of the recording layer 13. According to the arrangementshown in FIG. 14A, it is possible to further improve the perpendicularmagnetic anisotropy of the recording layer 13.

As shown in FIG. 14B, a boride layer may be used as a capping layer 22of the recording layer 13 instead of the underlayer of the recordinglayer 13. That is, the MTJ element 10 includes a lower electrode 11, areference layer 15, an intermediate layer 14, a recording layer 13, acapping layer 22, and an upper electrode 16 which are sequentiallystacked from the bottom. The capping layer 22 is made of the samematerial as that of the above-described underlayer 12. According to aso-called bottom pin structure shown in FIG. 14B, it is possible todecrease a write current and improve the perpendicular magneticanisotropy of the MTJ element 10, similarly to a so-called top pinstructure shown in FIG. 12.

In the modification shown in FIG. 14B, a magnetic layer made of the samematerial as that of the underlayer 17 may be inserted between therecording layer 13 and the capping layer 22, similarly to thearrangement shown in FIG. 14A. This can further improve theperpendicular magnetic anisotropy of the recording layer 13.

[4] Fourth Embodiment

In the fourth embodiment, a recording layer 13 has a stacked structureusing predetermined materials, and the perpendicular magnetic anisotropyof the recording layer 13 is improved.

[4-1] Arrangement of MTJ Element 10

FIG. 15 is a sectional view showing an example of the arrangement of theMTJ element 10 according to the fourth embodiment.

As shown in FIG. 15, the recording layer 13 has a stacked structureincluding a magnetic layer 13A on the underlayer 12 side, a magneticlayer 13C on the intermediate layer 14 side, and a nonmagnetic layer 13Bprovided between the magnetic layers 13A and 13C.

The magnetic layer 13A is desirably made of CoFe in which theconcentration of Co is higher than that of Fe. This can improve theperpendicular magnetic anisotropy of the recording layer 13. Note thatthe concentration of Co in the magnetic layer 13A made of CoFe ispreferably Co>50 at. % and, more preferably, Co≧90 at. %. This isbecause, if the concentration of Co is 50 at. % or higher, it ispossible to obtain an MR ratio of 70% or higher, and if theconcentration of Co is 90 at. % or higher, it is possible to obtain anMR ratio of 100% or higher. Furthermore, the magnetic layer 13A may bemade of Co, CoB, FeB, or CoFeB in which the concentration of Co ishigher than that of Fe.

The magnetic layer 13C is desirably made of CoFeB in which theconcentration of Fe is higher than that of Co. This can improve theperpendicular magnetic anisotropy of the recording layer 13. The reasonfor this is as follows. That is, since the crystal structure of iron(Fe) is the bcc (body-centered cubic) structure and the crystalstructure of cobalt (Co) is the hcp (hexagonal close-packed) structure,the crystal conformation of iron (Fe) with the intermediate layer (MgO)14 is better than that of cobalt (Co). The magnetic layer 13C may bemade of FeB.

From this point of view, it is possible to form an MTJ element 10 havinga high MR ratio by adjusting the magnetic layer 13A on the underlayer 12side of the recording layer 13 to be made of CoFe which contains Co at ahigh concentration, CoB, or FeB, and adjusting the magnetic layer 13C onthe intermediate layer 14 side of the recording layer 13 to be made ofCoFeB which contains Fe at a high concentration. Alternatively, when themagnetic layers 13A and 13C are mainly made of CoFe, it is possible toimprove the perpendicular magnetic anisotropy of the recording layer 13by making the concentration of Fe in the magnetic layer 13C higher thanthat in the magnetic layer 13A.

For the nonmagnetic layer 13B, a material containing one elementselected from the group consisting of tantalum (Ta), niobium (Nb),titanium (Ti), zirconium (Zr), hafnium (Hf), tungsten (W), yttrium (Y),lanthanum (La), silicon (Si), and aluminum (Al). The material of thenonmagnetic layer 13B may be used as an additive for the recording layer13 (FIG. 1 or the like) as a single layer or the magnetic layers 13A and13C (FIG. 15 or the like) of the recording layer 13 having a stackedstructure. Such nonmagnetic layer 13B can decrease the saturationmagnetization Ms of the recording layer 13 to suppress stray magneticfield interference between neighboring bits, and can reduce ademagnetization field to improve the thermal stability.

Practical examples of the magnetic layer 13C/nonmagnetic layer13B/magnetic layer 13A are CoFeB (8)/Ta (3)/CoFe (5), FeB/Ta/FeB,FeB/Ta/CoB, FeB/Nb/FeB, FeB/Nb/CoB, FeB/Ta/Co, and FeB/Ta/Co.

Note that if the film thickness of the nonmagnetic layer 13B insertedbetween the magnetic layers 13A and 13C increases, the spin scatteringin the magnetic layers 13A and 13C increases, thereby causing anincrease in write current. The film thickness of the nonmagnetic layer13B, therefore, is desirably 1 nm or smaller.

By omitting the nonmagnetic layer 13B of FIG. 15, the recording layer 13may be formed by two layers, that is, the magnetic layers 13A and 13C.For example, the magnetic layer 13A is made of CoFe or Co, and themagnetic layer 13C is made of CoFeB or FeB. The nonmagnetic layer 13Bcan increase the perpendicular magnetic anisotropy of the magnetic layerand the MR ratio but may cause an increase in damping constant. Byomitting the nonmagnetic layer 13B, it is possible to make the dampingconstant of the magnetic layer small, and to decrease a write current.Note that by adjusting the compositions of the magnetic layers 13A and13C forming the recording layer 13, it is possible to preventdegradation in the perpendicular magnetic anisotropy of the recordinglayer 13 due to the omission of the nonmagnetic layer 13B. It ispossible to improve the MR ratio and the perpendicular magneticcharacteristics of the recording layer 13 by making the concentration ofFe in the magnetic layer 13C on the intermediate layer 14 side higherthan that in magnetic layer 13A on the underlayer 12 side. For example,it is possible to improve the MR ratio and the perpendicular magneticcharacteristics of the recording layer 13 by using, as the recordinglayer 13, CoFeB (8)/CoFe (5) in which the concentration of Fe in themagnetic layer 13C is higher than that in the magnetic layer 13A, FeB(8)/CoFe (5), FeCoB (8)/Co (5), or FeB (8)/Co (5).

Note that the material of the above-described magnetic layer 13A,nonmagnetic layer 13B, or magnetic layer 13C may contain elements otherthan those in the above material, and need only contain the abovematerial as a major component.

The same material as that of the underlayer 12 in the first to thirdembodiments can be used as the material of the underlayer 12 in thefourth embodiment.

[4-2] Recording Layer 13 Having Stacked Structure

FIG. 16 shows the magnetic characteristics (M-H curves) of the MTJelement 10 when FeB or CoB is used as the magnetic layer 13A and Nb orTa is used as the nonmagnetic layer 13B in the recording layer 13including three layers. The range from −200 to 200 on the abscissa inFIG. 16 indicates a magnetic field (Oe) applied in a directionperpendicular to a film surface, and the range from −7000 to 7000indicates a magnetic field (Oe) applied in an in-plane direction. Theordinate in FIG. 16 represents the magnetization (emu) of the recordinglayer 13 in the direction perpendicular to the film surface and thein-plane direction. A solid line indicates the magnetic characteristicswhen the magnetic field is applied in the direction perpendicular to thefilm surface, and a dotted line indicates the magnetic characteristicswhen the magnetic field is applied in the in-plane direction. Note thatthe underlayer 12 is made of AlTiN, the magnetic layer 13C is made ofCoFeB, and the intermediate layer 14 is made of MgO.

As shown in FIG. 16, when AlTiN is used as the underlayer 12, it ispossible to obtain a high magnetic anisotropy field Hk (7 k) by formingthe magnetic layer 13C/nonmagnetic layer 13B/magnetic layer 13A of therecording layer 13 to have a stacked structure such as (a) CoFeB/Nb/FeB,(b) CoFeB/Nb/CoB, (c) CoFeB/Ta/FeB, or (d) CoFeB/Ta/CoB.

[4-3] Effects

According to the above-described fourth embodiment, the same effects asthose in the first to third embodiments can be obtained.

In the fourth embodiment, the recording layer 13 formed on theunderlayer 12 has the above-described stacked structure. This enables toimprove the perpendicular magnetic characteristics of the recordinglayer 13 as well as the MR ratio of the MTJ element 10.

[4-4] Modifications

The fourth embodiment can be modified to have the arrangement of the MTJelement 10 shown in FIGS. 17A and 17B.

As shown in FIG. 17A, a thin underlayer 17 may be provided between therecording layer 13 and the underlayer 12. An example of the underlayer17 is iridium (Ir) having a film thickness of 1 nm or smaller. Since athick Ir layer increases the damping constant of the recording layer 13,the film thickness of the Ir layer is desirably 1 nm or smaller. Inaddition to iridium (Ir), palladium (Pd), platinum (Pt), and the likecan be used as the material of the underlayer 17. Note that it isnecessary to make the underlayer 17 thin so as not to increase thedamping constant of the recording layer 13. According to the arrangementshown in FIG. 17A, it is possible to further improve the perpendicularmagnetic anisotropy of the recording layer 13.

As shown in FIG. 17B, an AlTiN layer, a TiN layer, or a boride layer maybe used as a capping layer 22 of the recording layer 13 instead of theunderlayer of the recording layer 13. That is, the MTJ element 10includes a lower electrode 11, a reference layer 15, the intermediatelayer 14, the recording layer 13, the capping layer 22, and an upperelectrode 16 which are sequentially stacked from the bottom. The cappinglayer 22 is made of the same material as that of the above-describedunderlayer 12. According to a so-called bottom pin structure shown inFIG. 17B, it is possible to obtain the effects of decreasing a writecurrent, improving the perpendicular magnetic anisotropy of the MTJelement 10, and decreasing a variation in the write current, similarlyto a so-called top pin structure shown in FIG. 15.

In the modification shown in FIG. 17B, a magnetic layer made of the samematerial as that of the underlayer 17 may be inserted between therecording layer 13 and the capping layer 22, similarly to thearrangement shown in FIG. 17A. This can further improve theperpendicular magnetic anisotropy of the recording layer 13.

[5] Fifth Embodiment

In the fifth embodiment, a bias layer 31 having a function of decreasinga magnetic stray field from a reference layer 15 is newly added toprevent a shift of a magnetic switching field of a recording layer 13due to the magnetic stray field.

[5-1] Arrangement of MTJ Element 10

The arrangement of the MTJ element 10 according to the fifth embodimentwill be described with reference to FIG. 18.

The MTJ element 10 of the fifth embodiment has an arrangement obtainedby newly adding the bias layer 31 and a nonmagnetic layer 32 to thearrangement shown in FIG. 1.

The bias layer 31 is provided to prevent a shift of the magneticswitching field of the recording layer 13 due to the magnetic strayfield from the reference layer 15, and a change in thermal stabilitybetween a case in which the magnetization arrangements of the referencelayer 15 and recording layer 13 are in a parallel state and a case inwhich the magnetization arrangements are in an antiparallel state. It ispossible to use, for the bias layer 31, the same perpendicularmagnetization material as the reference layer 15.

The nonmagnetic layer 32 desirably provides antiferromagnetic couplingbetween the bias layer 31 and the reference layer 15 such that theirmagnetization directions are antiparallel to each other. The nonmagneticlayer 32 has heat resistance such that the bias layer 31 and referencelayer 15 do not mix in a heat process, and a function of controlling thecrystal orientation in forming the bias layer 31. A nonmagnetic metalcontaining ruthenium (Ru), silver (Ag), or copper (Cu) can be used asthe nonmagnetic layer 32.

A magnetic layer made of CoFe, Co, Fe, CoFeB, CoB, FeB, or the like maybe inserted between the bias layer 31 and the nonmagnetic layer 32 orbetween the reference layer 15 and the nonmagnetic layer 32. This makesit possible to reinforce the antiferromagnetic coupling between the biaslayer 31 and the reference layer 15 via the nonmagnetic layer 32.

Note that the same material as that of the underlayer 12 in the first tothird embodiments can be used as the material of an underlayer 12 in thefifth embodiment. The recording layer 13 may have the same arrangementas that in the fourth embodiment.

[5-2] Effects

According to the fifth embodiment, it is possible to obtain the sameeffects as those in the first to fourth embodiments.

In the fifth embodiment, the bias layer 31 can decrease the magneticstray field from the reference layer 15. This can decrease a shift ofthe magnetic switching field of the recording layer 13 due to themagnetic stray field. As a result, it is possible to decrease adistribution in the magnetic reversal field of the recording layer 13among the MTJ elements 10. By providing the bias layer 31, it ispossible to firmly fix the magnetization of the reference layer 15 inone direction.

[5-3] Modifications

The fifth embodiment can be modified to have the arrangement of the MTJelement 10 shown in FIGS. 19, 20A, 20B, 21A and 21B.

As shown in FIG. 19, the bias layer 31 may be provided between a lowerelectrode 11 and the underlayer 12. In this case, by setting themagnetization of the bias layer 31 in the opposite direction to thereference layer 15, it is possible to decrease a magnetic stray fieldfrom the reference layer 15.

As shown in FIGS. 20A and 20B, a thin underlayer 17 may be providedbetween the recording layer 13 and underlayer 12. An example of theunderlayer 17 is iridium (Ir) having a film thickness of 1 nm orsmaller. Since a thick Ir layer increases the damping constant of therecording layer 13, the film thickness of the Ir layer is desirably 1 nmor smaller. In addition to iridium (Ir), palladium (Pd), platinum (Pt),and the like can be used as the material of the underlayer 17. Note thatit is necessary to make the underlayer 17 thin so as not to increase thedamping constant of the recording layer 13. According to the arrangementshown in FIGS. 20A and 20B, it is possible to further improve theperpendicular magnetic anisotropy of the recording layer 13.

As shown in FIGS. 21A and 21B, an AlTiN layer, a TiN layer, or a boridelayer may be used as a capping layer 22 of the recording layer 13instead of the underlayer of the recording layer 13. That is, the MTJelement 10 shown in FIG. 21A includes the lower electrode 11, the biaslayer 31, the nonmagnetic layer 32, the reference layer 15, anintermediate layer 14, the recording layer 13, the capping layer 22, andan upper electrode 16 which are sequentially stacked from the bottom.The MTJ element 10 shown in FIG. 21B includes the lower electrode 11,the reference layer 15, the intermediate layer 14, the recording layer13, the capping layer 22, the bias layer 31, and the upper electrode 16which are sequentially stacked from the bottom. The capping layer 22 ismade of the same material as that of the above-described underlayer 12.According to the structure shown in FIGS. 21A and 21B, it is possible toobtain the effects of decreasing a write current, improving theperpendicular magnetic anisotropy of the MTJ element 10, and decreasinga variation in the write current, similarly to the structure shown inFIG. 18.

In the modification shown in FIGS. 21A and 21B, a magnetic layer made ofthe same material as that of the underlayer 17 may be inserted betweenthe recording layer 13 and the capping layer 22, similarly to thearrangement shown in FIGS. 20A and 20B. This can further improve theperpendicular magnetic anisotropy of the recording layer 13.

[6] Sixth Embodiment

The sixth embodiment attempts to improve an MR ratio using an underlayer12 containing oxygen.

[6-1] Arrangement and Manufacturing Method of Underlayer 12

In the sixth embodiment, to form the underlayer 12 on a lower electrode11, the following manufacturing method is performed.

For example, a Ta layer having a film thickness of 5 nm is deposited asthe lower electrode 11, and radical oxidation is performed for thesurface of the Ta layer for 100 sec, thereby forming a TaO layer.Etching is performed for the surface of the TaO layer. An AlTiN layer isdeposited as the underlayer 12. By performing such manufacturing method,the underlayer 12 (for example, an AlTiNO layer) containing oxygen isformed.

As described above, oxidation is performed to form an oxide prior todeposition of the underlayer 12, but the sixth embodiment is not limitedto this. For example, after the lower electrode 11 is deposited, one ofnitriding, boriding, and carbonization may be performed for the surfaceof the lower electrode 11 to form a nitride, boride, or carbide. In thiscase, the underlayer 12 contains N, B, or C. In this embodiment,therefore, the underlayer 12 may contain one element selected from thegroup consisting of O, N, B, and C. Furthermore, at least one of theunderlayer 12 and lower electrode 11 may contain one element selectedfrom the group consisting of O, N, B, and C.

Note that the same material as that of the underlayer 12 in the first tothird embodiments can be used as the material of the underlayer 12 inthe sixth embodiment. A recording layer 13 can have the same arrangementas that in the fourth embodiment. It is also possible to provide a biaslayer as in the fifth embodiment. Furthermore, a modification in eachembodiment is applicable.

[6-2] Effects

According to the sixth embodiment, it is possible to obtain the sameeffects as those in the first to fifth embodiments.

In the sixth embodiment, it is possible to form the underlayer 12containing oxygen, nitrogen, boron, or carbon by performing one ofoxidation, nitriding, boriding, and carbonization prior to deposition ofthe underlayer 12. This can decrease the interfacial energy indepositing an AlTiN layer as the underlayer 12, thereby improving theflatness of the underlayer 12. Furthermore, it is possible to improvethe flatness of the lower electrode 11 by etching the surface of the TaOlayer. As a result, it is possible to improve the flatness of therecording layer 13 and an intermediate layer 14. This can furtherimprove the MR ratio.

As described above, according to the magnetoresistive element in theabove-described embodiment, the underlayer 12 of the MTJ element 10 hasan arrangement so as to decrease the damping constant. With thisarrangement, it is possible to attempt to decrease a write current.

Note that in this specification, “nitride”, “boride”, “carbide”, or“oxide” may contain B, N, O, or C, and need only be “nitrogen-containingsubstance”, “boron-containing substance”, “carbon-containing substance”,or “oxygen-containing substance”.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

What is claimed is:
 1. A magnetoresistive element comprising: a firstmagnetic layer; a second magnetic layer; a nonmagnetic layer providedbetween the first magnetic layer and the second magnetic layer; and afirst underlayer containing B and provided on an opposite side of asurface of the second magnetic layer on which the nonmagnetic layer isprovided, wherein the first underlayer comprises an amorphous structure,and is nonmagnetic.
 2. The magnetoresistive element according to claim1, wherein the first underlayer further contains Hf or Ta.
 3. Themagnetoresistive element according to claim 1, wherein the firstunderlayer further contains a compound of B and Hf, or a compound of Band Ta.
 4. The magnetoresistive element according to claim 1, furthercomprising a second underlayer provided between the second magneticlayer and the first underlayer.
 5. The magnetoresistive elementaccording to claim 4, wherein the second underlayer contains one of Ir,Pd, or Pt.
 6. The magnetoresistive element according to claim 4, whereinthe second underlayer is thinner than the first underlayer.
 7. Themagnetoresistive element according to claim 1, wherein the firstmagnetic layer has magnetic anisotropy perpendicular to a film surfaceand having an invariable magnetization direction, and the secondmagnetic layer has magnetic anisotropy perpendicular to a film surfaceand having a variable magnetization direction.
 8. The magnetoresistiveelement according to claim 1, wherein the nonmagnetic layer contains aninsulator.
 9. The magnetoresistive element according to claim 8, whereinthe insulator contains a MgO.
 10. The magnetoresistive element accordingto claim 1, wherein the nonmagnetic layer is a tunnel barrier layer.